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Welcome to GlobalSpec - a trusted source for engineers and industrial professionals.
Search GlobalSpec to find BGA-related products, suppliers, datasheets and CAD.
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Keep current on the latest products, new suppliers, and technical articles of interest to you. (See Topics) |
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Products/Services for BGA
Printed circuit board (PCB) fabrication services design and fabricate circuit boards. They differ from electronic manufacturing services, which populate and assemble boards. Search by Specification | Learn More about Printed Circuit Board (PCB) Fabrication Services
Electronics assembly service companies based on providing contract design, manufacturing, and related product support services on behalf of electronics OEMs. Search by Specification | Learn More about Electronic Manufacturing Services (EMS)
...include ball grid array (BGA), chip scale package (CSP), single in-line package (SIP), dual in-line package (DIP), plastic leaded chip carrier (PLCC), small outline integrated circuit (SOIC), and transistor outline (TO). BGA places output pins... Search by Specification | Learn More about IC Sockets and Headers
IC sockets and interconnect components interface or connect a microelectronic semiconductor chip to a board or larger scale device. Search by Specification | Learn More about IC Sockets and Interconnect Components
IC package converters and adapters. Choices include ball-grid array (BGA), land-grid array (LGA), pin grid array (PGA), and interstitial package grid array (IPGA); single in-line package (SIP), dual in-line package (DIP), quad flat package (QFP... Search by Specification | Learn More about IC Package Converters and Adapters
Electronic packaging and integrated circuit packaging is the final stage of semiconductor device fabrication in which the bare die or bare boards are placed inside of a protective packaging that provides connectors or pins for connecting to other devices. Learn More about Electronic and IC Packaging Services
Computer-aided design (CAD) services assist in the computerized design, three-dimensional (3D) modeling, and printing and drafting of engineering components and assemblies. Search by Specification | Learn More about Computer-Aided Design (CAD) Services
Brazing and soldering services use welding techniques and related processes to fabricate parts and join components. Search by Specification | Learn More about Brazing and Soldering Services
Interposers are special connecting devices that are used to interface one socket to another. Learn More about Interposers
X-ray instruments and X-ray systems use penetrating X-rays or gamma radiation to capture images of the internal structure of a part or finished product. Search by Specification | Learn More about X-ray Instruments and X-ray Systems
Engineering design firms provide total design for new components, products and equipment, including load analysis, part and material specification, manufacturing drawings, product manuals, and often manufacturing support and/or certification documentation Learn More about Engineering Design Services
PCB design and layout services providers generate schematics and CAD files for printed circuit boards. Search by Specification | Learn More about PCB Design and Layout Services
Conformal coatings encapsulate circuit boards and their electronic components in order to prevent the ingress of moisture, fungus, dust and other environmental contaminants. Search by Specification | Learn More about Conformal Coatings
...logic plus (GTLP) are also available. Digital latches are available in a variety of IC package types and with different numbers of pins and flip-flops. Basic IC package types for digital latches include ball grid array (BGA), quad flat package (QFP... Search by Specification | Learn More about Digital Latches
...in a variety of IC package types and with different numbers of pins and flip-flops. Basic IC package types for flip-flops include ball grid array (BGA), quad flat package (QFP), single in-line package (SIP), and dual in-line package (DIP). Many packaging... Search by Specification | Learn More about Flip-flops
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New Workshop - Specifying Printed Wiring Boards UL University - Underwriters Laboratories Inc.
Surface Mount Technology (SMT) Production Matric
Hardware and Software Design MAZeT GmbH
Contract Design/Engineering Services Matric
Through-Hole Technology (THT) Production Matric
PCBAEMS DNC Electronics Co., Ltd.
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Product News for BGA
BGA Reed Relays Provide Superior RF Performance
Coto Technology, of Providence, RI, has announced the release of two patented ball-grid-array (BGA) Reed Relays. The B10 and B40 BGA relays utilize breakthrough patented technology to provide leadless relay designs with enhanced RF performance. The signal path in the BGA between input and output is ... (read more)
BGA Rollerball® Sockets & Adapters
Designed to revolutionize BGA assembly and improve reliability and quality! (read more)
Coto Introduces Ground-Breaking BGA Relay
Coto Technology has introduced the first four independent channel, form-A, planar BGA Reed Relay. The B41 series is the latest offering in Coto's growing line of RF capable, reed relay products. Unlike Coto's B10, B40 and other high-performance RF reed relay products, no slot or hole in the PC board is required to mount the device - a feature which simplifies the design of multi-layer boards. (read more)
MX-BGAZ II
This BGA lens allows ball joints to be observed non-destructively. Also, a 3D optical rotary ring enables 3D observation. This lens incorporates special hardware, such as a prism tip with lighting and a cushion mechanism, to ensure comfortable observation. (read more)
APR-5000 Series Array Package Rework Systems
Rework Systems (BGA Rework Systems) that incorporate state-of-the-art vision, and closed-loop time, temperature and airflow control. (read more)
PCB Design and Fabrication
Caladena Group fabricated a four-layered PCB for Defence R&D Canada. We also used a special heating process to mount a GPS module (BGA chip). (read more)
MRS-1000 Modular Rework System
The MRS-1000 Modular Rework System is an integrated convection rework system for
the removal and placement of BGA/CSP and SMT components. (read more)
SMT-Surface Mount Assembly
We have the skill, expertise and equipment to meet your needs!
SMT, surface mount PCB printed circuit board assebly including BGA repair, fine pitch, prototyping as well as hand build, 402, SOIC, PLCC, QFP, BGA, packages, X-ray and AOI capabilities. (read more)
Industry's smallest Hall IC packages by ROHM
ROHM formally introduces its complete line of Hall Effect ICs for portable electronics applications. An important feature of the product family is its availability in the industry's smallest chip-scale BGA package, measuring just 1.1 mm square with a package height of just 0.5 mm. A slightly larger surface-mount package, measuring 1.6 x 1.6 x 0.6 mm, is also available. (read more)
FlashPAK II™ Networked Programming System
The FlashPAK II™ Networked Programming System supports the latest high-density Flash memory, NAND Flash, Microcontroller and EEPROM devices at maximum programming speeds and highest quality per device. FlashPAK II is the second generation programming architecture extending Data I/O's unique design for high-speed Flash support. (read more)
Parts by Number for BGA
| Part # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| BGA | Mectronic | GoatThroat | Not Provided | GoatThroat |
| BGA | netCOMPONENTS | Not Provided | Not Provided | Not Provided |
| 2MCY6 | Grainger Industrial Supply | WESTCOTT DISTRIBUTION INC | Pneumatic Regulators | Adapter, Air, 1/4 NPT (In) |
Conduct Research
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Ball Grid Array (BGA)
Ball-grid array (BGA) is an integrated circuit (IC) package type that places output pins in a solder-ball matrix. BGA traces are fabricated on polyimide-based films, or on laminated substrates such as...(read more)
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Comprehensive Methodology to Characterize and Mitigate BGA Pad Cratering in Printed Circuit Boards
The conversion to lead-free Ball Grid Array (BGA) packages has raised several new assembly and reliability issues. One reliability concern becoming more prevalent is the increased propensity of pad...(read more)
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GHz BGA Socket User Manual
The IC package drawing is required to select the correct GHz socket. Go to www.ironwoodelectronics.com. Select the "Products" link, then under the "Browse" menu, select the "GHz BGA & MLF socket"...(read more)
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Giga-snaP BGA SMT Adapters
The new Giga-snaP line of BGA SMT adapters provide the most reliable interconnect to BGA SMT pads. These patent pending adapters remain attached through many solder cycles and will not warp as plastic...(read more)
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Advanced Thermal Interface Materials for Enhanced Flip Chip BGA
Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use...(read more)
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BGA Socket Considerations - Prototype to Reality
For many products designed with todays high-performance integrated circuits, BGA socketing systems are an essential option during the design, testing, and/or production phases of a new product...(read more)
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BGA Socket with Heatsink for High Power Devices
The classic function of a socket is to provide a connection mechanism from the IC (Integrated Circuit) to the circuit board with as little electrical load as possible. This allows the IC to function...(read more)
- Achieving GHz Speed in Socketed BGA Devices
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Spring Pin Socket User Manual
SS-BGA sockets provide high bandwidth in a small, cost effective ZIF socket for prototype, test and burn-in applications. SS-BGA socket is a simple, mechanical socket based on spring pin technology....(read more)
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M513: Tape and Reel Packaging for Surface Mount Components
M/A-COM supplies integrated circuits, diodes, and related surface mount components in tape wound on standard 7-inch, 8-inch, 10-inch, and 13-inch diameter reels. This application note documents the...(read more)
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XAPP426: Implementing Xilnx Flip Chip BGA Packages R Implementing Xilinx Flip-Chip BGA Packages XAPP426 (v1.3) March 3, 2006 Summary Xilinx flip-chip BGA package is offered for Xilinx high-performance See Xilinx, Inc. Information |
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Xilinx PK236 Flip-Chip BGA (FF323/FFG323) Package R Flip-Chip BGA (FF323/FFG323) Package PK236 (v1.1) March 24, 2008 323-BALL FLIP-CHIP BGA (FF323/FFG323) ? 2007, 2008 Xilinx, Inc. All rights See Xilinx, Inc. Information |
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BGA - Wikipedia, the free encyclopedia BGA From Wikipedia, the free encyclopedia BGA can refer to: Ball Grid Array, a type of surface-mount packaging used for integrated circuits |
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AN-5026 Using BGA Packages Typical BGA applications include: 1. Notebook computers 2. Personal Digital Assistants (PDA's) 3. Mobile telephone handsets 4. High density disk See Fairchild Semiconductor Corporation Information |
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BGA-42 - 42BALL,USS-BGA,JEDEC MO-225,3.5MM WIDE, Fairchild... Home > Analog Products > FPS Products > Analog and Mixed Signal Packaging > BGA-42 - 42BALL,USS-BGA,JEDEC MO-225,3.5MM WIDE See Fairchild Semiconductor Corporation Information |
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OKI BGA-380-380 - BGA Nozzle For BGA-3591 Rework System, 38 x... BGA Nozzle For BGA-3591 Rework System, 38 x 38mm, Replaces BGA-33 See All-Spec Industries Profile & Catalog |
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REV. RELEASED EC# OS1G-0411-04 REV. REV. O APP'D: DES 9-1-04... REV. RELEASED EC# OS1G-0411-04 A APP'D: HXC-BGA BGA Application Guide Recommended information for BGA socketing applications. |
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BGA - Tyco Electronics Home > Products > By Type > Heat Sinks & Thermal Solutions > BGA BGA Product Line Package Size Features Document(s) |
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Emulation Technology - BGA Burn-in Sockets / BGA Test Sockets BGA Burn-in Sockets / BGA Test Sockets How to Determine a Part Description See Emulation Technology, Inc. Information |
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Ball Grid Array (BGA) Packaging 14 14.1 Introduction Ball Grid Array (BGA) Packaging 14 14.1 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for See Intel Corporation Information |
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