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Products/Services for chip scale packaging
The T-1000 Advanced Poly-Bagger™ just got better! It's now available with our patented "Next Bag Out" printing capabilities. The bag that's being printed is the next one to be filled - takes out the guesswork and virtually eliminates mislabeled bags! (read more)
Packaging machinery is used to package products or components, including equipment that forms, fills, seals, wraps, cleans and packages at different levels of automation. Search by Specification | Learn More about Packaging Machinery
IC sockets and interconnect components interface or connect a microelectronic semiconductor chip to a board or larger scale device. Search by Specification | Learn More about IC Sockets and Interconnect Components
IC package converters and adapters are electronic interconnect devices that are used to interface different types of integrated circuit (IC) sockets. Search by Specification | Learn More about IC Package Converters and Adapters
Scales and balances are used to measure static or dynamic loads for a wide range of industrial applications. Search by Specification | Learn More about Scales and Balances
Specialty packaging and labeling equipment and supplies are specialized or proprietary machines, products and accessories for packaging and labeling applications. Learn More about Specialty Packaging and Labeling Equipment
RF and wireless chips are integrated circuits (IC) that are designed specifically for radio frequency (RF), microwave, and other wireless communications or data transmission applications. Search by Specification | Learn More about RF and Wireless Chips
Network and communication chips are semiconductor integrated circuits (IC) used in telecommunication devices and systems. Search by Specification | Learn More about Network and Communication Chips
Microcontrollers (MCU) are complete computer systems on a chip. They combine an arithmetic logic unit (ALU), memory, timer/counters, serial port, input/output (I/O) ports and a clock oscillator. Search by Specification | Learn More about Microcontrollers (MCU)
SOIC), shrink small outline package (SSOP), small outline package (SOP) and chip scale or chip size package (DSP) products are also available. Additional integrated circuit (IC) package types for audio amplifier chips include mini small outline plastic... Search by Specification | Learn More about Audio Amplifier Chips
Digital-to-analog converter (DAC) chips convert digital signals that represent binary numbers into proportional analog voltages. Search by Specification | Learn More about Digital-to-Analog Converter (DAC) Chips
...single in-line package (SIP) chip scale package (CSP), or small outline IC (SOIC). Operational amplifiers with transistor outline (TO), small outline transistor (SOT), and plastic leaded carrier (PLCC) IC packaging are also available. Like other ICs... Search by Specification | Learn More about Operational Amplifiers
Electronic packaging and integrated circuit packaging is the final stage of semiconductor device fabrication in which the bare die or bare boards are placed inside of a protective packaging that provides connectors or pins for connecting to other Learn More about Electronic and IC Packaging Services
Rules are flat, graduated scales used for length measurement. For OEM applications, digital or electronic linear scales are often used. Search by Specification | Learn More about Rules and Scales
Biotechnology and pharmaceutical manufacturing services active pharmaceutical ingredients, sterilize biomedical components or materials, validate processes or packaging, and formulate drug or medicinal preparations on a contract Search by Specification | Learn More about Biotechnology and Pharmaceutical Manufacturing Services
Instrumentation amplifier chips are precision amplifier circuits with both high-impedance differential inputs and high common-mode rejection. Search by Specification | Learn More about Instrumentation Amplifier Chips
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High Speed Automated Packaging Loaders Arthur G. Russell
Large Capacity Friction Feeding System PSI Engineering
Hands Free Towel Inspection and Packaging System Advanced Poly-Packaging, Inc.
Capless Sealing Lepel Corporation
APPS | Mail Order Pharmacy Automation PSI Engineering
Automatic Tabletop Bagger/Printer Advanced Poly-Packaging, Inc.
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Product News for chip scale packaging
Revolutionary New Chip Scale Packaging Flash Demo
This flash shows a breakthrough in packaging technology that brings wireless chip micro-miniaturization and high frequency performance to new levels. (read more)
HMC6352, Two-Axis, Chip-Scale Digital Compass
Honeywell introduces the HMC6352, a two-axis, chip-scale digital compass for GPS applications, personal navigation, vehicle telematics, consumer electronics, and general two-axis compassing. (read more)
Industry's smallest Hall IC packages by ROHM
ROHM formally introduces its complete line of Hall Effect ICs for portable electronics applications. An important feature of the product family is its availability in the industry's smallest chip-scale BGA package, measuring just 1.1 mm square with a package height of just 0.5 mm. A slightly larger surface-mount package, measuring 1.6 x 1.6 x 0.6 mm, is also available. (read more)
Mini position sensor+encoder: 0.5micron resolution
Now with higher resolution and smaller (chip-scale) packaging, the "world's smallest linear encoder" offers robust, precise positioning for miniature imaging systems, consumer electronics, precision biomedical devices, optical instrumentation and more... (read more)
Developer kits for piezo micro motor, mini sensor
Kits feature New Scale's tiny SQUIGGLE piezoelectric micro motor and TRACKER NSE-5310 miniature position sensor; serve as reference designs for closed-loop OEM system integration down to 0.5 micron resolution (read more)
Developer's kit for mini position sensor / encoder
Kits feature New Scale's TRACKER NSE-5310 miniature position sensor and tiny SQUIGGLE piezoelectric micro motor; serve as reference designs for closed-loop OEM system integration down to 0.5 micron resolution. (read more)
UMTS Band 2 Duplexer
New UMTS Duplexer is One-Third Smaller Than Previous Versions and Provides Designers with Advanced RF Performance (read more)
ACU-RITE Glass Scales vs. Ball-Bearing Technology
ACU-RITE® Glass Scales vs. Ball-Bearing Technology (read more)
HEIDENHAIN CNC Linear Scales
Linear encoders from HEIDENHAIN for CNC machine tools can be used nearly everywhere. They are ideal for machines and other equipment whose feed axes are in a closed loop, such as milling machines, machining centers, boring machines, lathes and grinding machines. (read more)
BEMP Belt Scales
To monitor production, ensure proper blends and benefit from plant automation, you need reliable, certified belt scale performance, high accuracy and repeatability. Schenck AccuRate Belt Scales and Controls provide material processing managers with superior, continuous in-line belt performance information. Monitor rate, totalize weight, speed and load from your conveyors using simple,... (read more)
Parts by Number for chip scale packaging
| Part # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| FCSP2H40LTR | Future Electronics | VISHAY | Not Provided | FCSP240LTR Series 40 V 1.5 A Chip Scale Package Schottky Barrier Rectifier |
| FCSP1H40LTR | Future Electronics | VISHAY | Not Provided | FCSP1H40LTR Series 40 V 1 A Chip Scale Package Schottky Barrier Rectifier |
| FCSP240LTR | Future Electronics | VISHAY | Not Provided | FCSP240LTR Series 40 V 1.5 A Chip Scale Package Schottky Barrier Rectifier |
| FCSP130LTR | Future Electronics | VISHAY | Not Provided | FCSP130LTR Series 30 V 1 A Chip Scale Package Schottky Barrier Rectifier |
| FCSP230LTR | Future Electronics | VISHAY | Not Provided | FCSP230LTR Series 30 V 1.5 A Chip Scale Package Schottky Barrier Rectifier |
Conduct Research
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Avago Introduces 18 GHz and 26.5 GHz Low-Noise E-pHEMT in 0402 Compatible Packages Produced by Advanced Wafer-Scale Packaging Technology (.pdf)
Smaller, lower cost components are crucial to the devel¬opment of today's higher-performance, smaller and in¬creasingly price-competitive mobile devices. Since the introduction of chip scale packages...(read more)
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Avago Introduces 18 GHz and 26.5 GHz Low-Noise E-pHEMT in 0402 Compatible Packages Produced by Advanced Wafer-scale Packaging Technology
Smaller, lower cost components are crucial to the devel¬opment of today's higher-performance, smaller and in¬creasingly price-competitive mobile devices. Since the introduction of chip scale packages...(read more)
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Chip Scale Package (CSP)
Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level...(read more)
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CMOS LDO Regulators for Portable Devices (.pdf)
ROHM CMOS LDO (low drop-out) regulators are tailored for use in portable devices such as PDAs, mobile phones, digital cameras and camcorders. Lower in cost and small in packaging, ROHM CMOS LDOs offer...(read more)
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The Chip Scale Package (CSP) 15 15.1 Introduction The Chip Scale Package (CSP) 15 15.1 Introduction Since the introduction of Chip Scale Packages (CSP's) only a few short years ago, they have become See Intel Corporation Information |
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Chip scale package - Wikipedia, the free encyclopedia As only a few packages are chip size, the meaning of the acronym was adapted to Chip Scale Packaging. |
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Welcome - Chip Supply Chip Scale Packaging - DieScale WLCSP / Bumping Multi Chip Packaging Tape Automated Bond See Chip Supply, Inc. Information |
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Understanding Flip-Chip and Chip-Scale Package Technologies... Keywords: flip, chip, scale, wafer, level, package, packages, packaging, wlp, ucsp, fchip, wlcsp, pb free, rohs, topmark, bump, die See Maxim Integrated Products, Inc. Information |
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Wire Bond, Gold Wire Bonder | Palomar Technologies Multi-Chip Module Component Packaging System On Chip Flip Chip Pick And Place Optoelectronic Packaging See Palomar Technological Companies Information |
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Chip Scale Packaging - Computing Reference - eLook.org Chip Scale Packaging <hardware> (CSP) Surface Mount International attendees debated chip scale technologies as system |
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[No Title] CHIP SCALE PACKAGES World's smallest 44 pin footprint Packaging CSP/LLP - World's smallest 28/32/44 pin footprints. See National Semiconductor Information |
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The Effect of Electromigration on Eutectic SnPb and Pb-free... Electromigration on Eutectic SnPb and Pb-free Solders in Wafer Level-Chip Scale Packages Joanne Huang1, Stephen Gee2, Luu Nguyen2, King-Ning Tu1 See National Semiconductor Information |
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Fujitsu Features Package Solutions Including Bump FCBGA, CSPs,... semiconductor packaging technologies, will showcase its new Flip-Chip Ball Grid Array (FCBGA) lead-free packages and other chip scale packages (CSP) |
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Packaging Documentation : FUJITSU United States ASIC Packaging Fact Sheet (512KB PDF) Chip Scale Packages (FBGA) Fact Sheet (164KB PDF) |
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