Typically, the cost of packaging can range anywhere from 30% to 95% of the total cost of MEMS products. ITC's all new, state-of-the-art packaging facility provides extensive electronic and optoelectronic packaging assembly capabilities can help drive down these costs by providing the proper work environment and critical interfaces between a device and macroscopic world. (read more)

Surface Mount, BGA, Micro-BGA, Thru-hole, Mixed Technology, Fine Pitch, Conformal Coating, Cleanliness Testing X-ray Inspection. Both low and medium volume production lines are available. (read more)

Employing automated pick-and-place electronic assembly equipment, Electrasem's contract manufacturing capabilities range from small prototype runs to medium volume assembly. Standard component sizes range from the 0402 chip to PLCC 84, measuring 1 inch. Quad Vision systems provide fine pitch placements. Cleaning is provided in a closed-loop filtration de-ionization system. (read more)

Getting the HDMI digital video signal from point A to point B doesn't have to be as hard as it seems. L-com Connectivity Products now offers a line of HDMI products that extend your video signal with minimal effort. This includes HDMI cables and more. (read more)

Mettrix Technology provides a full range of electronic assembly services from prototyping to medium quantity production runs of up to 10,000 pieces or more depending on the type of assembly required. Our assembly services are divided into two tiers: Quick Turn Prototyping, and Production. (read more)

Mettrix Technology provides a full range of electronic assembly services from prototyping to medium quantity production runs of up to 10,000 pieces or more depending on the type of assembly required. (read more)

On electronic designs, Chip-On-Board (COB) allows more functions to put in the same amount of space to achieve miniaturization of volume and weight. (read more)

Mettrix Technology provides a full range of electronic assembly services from prototyping to medium quantity production runs of up to 10,000 pieces or more depending on the type of assembly required. (read more)

RSP works with world class manufacturers in China and Taiwan for medium to high volume electronics manufacturing and box builds.

The key to working with Asian manufacturers is having a local presence, a quality inspection team, and negotiated pricing for volume discounts.

Capabilities include;

• SMT: Micro BGA, BGA, FPC, Ceramic PCB, Flip Chip (read more)

High-performance assembly systems, based on highly standardized modules. Machine speed: from 10 up to 100 cycles/min. Adaptability for new variants. PC controller. Up to 60% reusability. (read more)