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Products/Services for flip chip assembly
The Caladena Group is a one-stop shop for all of your electronic and electro--mechanical product requirements. (read more)
Electronics assembly service companies based on providing contract design, manufacturing, and related product support services on behalf of electronics OEMs. Search by Specification | Learn More about Electronic Manufacturing Services (EMS)
...capillary underfills, thermal interface material, and flip-chip attach fluxes. These electronic packaging materials provide greater versatility and durability than traditional materials such as ceramics and silicon. Electronic and IC packaging services... Learn More about Electronic and IC Packaging Services
IC sockets and interconnect components interface or connect a microelectronic semiconductor chip to a board or larger scale device. Search by Specification | Learn More about IC Sockets and Interconnect Components
...encapsulating the entire assembly. Low viscosity resins or varnishes are used to impregnate coils or coat wires. Adhesives and die bonding encapsulants and potting compounds are thermal interface materials that are used to join components... Search by Specification | Learn More about Encapsulants and Potting Compounds
Flip-flops are digital logic devices that synchronize changes in output state (1 or 0) according to a clocked input. Search by Specification | Learn More about Flip-flops
Diode arrays are composed of multiple discrete (usually unconnected) diodes on a single silicon chip. Diode arrays are important semiconductor products because they save assembly time and improve reliability over individually packaged diodes Search by Specification | Learn More about Diode Arrays
Microcontrollers (MCU) are complete computer systems on a chip. They combine an arithmetic logic unit (ALU), memory, timer/counters, serial port, input/output (I/O) ports and a clock oscillator. Search by Specification | Learn More about Microcontrollers (MCU)
Chip resistors are passive resistors with a form factor of an integrated circuit (IC) chip. Typically, they are manufactured using thin-film technology. Search by Specification | Learn More about Chip Resistors
Cable assemblies are collections of wires or cables banded into a single unit with connectors on at least one end. Search by Specification | Learn More about Cable Assemblies
Electrical and electromechanical assembly services provide board-level assembly, chassis and rack panel wiring, and front panel assembly. Typically, suppliers provide the complete turnkey production of electronic and electromechanical Search by Specification | Learn More about Electrical and Electromechanical Assembly Services
RF and wireless chips are integrated circuits (IC) that are designed specifically for radio frequency (RF), microwave, and other wireless communications or data transmission applications. Search by Specification | Learn More about RF and Wireless Chips
Serial cable assemblies are used for the serial transmission of data. They support communication standards such as RS232, RS422, and RS485, as well as Fibre Channel, FireWire or IEEE 1394, USB 1.1, and USB 2.0. Search by Specification | Learn More about Serial Cable Assemblies
Network and communication chips are semiconductor integrated circuits (IC) used in telecommunication devices and systems. Search by Specification | Learn More about Network and Communication Chips
Cable assemblies services manufacture custom, connectorized cables such as coaxial, fiber optic and multiconductor products. Search by Specification | Learn More about Cable Assembly Services
Wire and connector assembly and installation tools are used to assemble and install connectors. Search by Specification | Learn More about Wire and Connector Assembly and Installation Tools
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Manufacturing Services RDI, Inc.
Stop Worrying! PCBA's Built Right and On Time! Pro-Active Engineering, Inc.
Printed Circuit Board Assembly Paradigm Contract Manufacturing LLC
Printed Circuit Board Assemblies Advanced Manufacturing Service, Inc. (AMS)
Aftermarket Services Matric
Atmel Atmega Microcontroller AMEGA 2560-16AU Caladena Group
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Product News for flip chip assembly
Flip Chip on Flexible Circuitry
High volume flip chip on flexible circuitry is routine at Automated Assembly. The original roll-to-roll process developed at Automated Assembly was created specifically for flip Chip assembly onto one thousand foot rolls of circuitry. (read more)
TxRx Optical Links For Flip Chip Components
Custom multimode polymer waveguide TxRx arrays are created in self supporting films. Micromachining singulates array strips, creates I/O mirrors & coupling interfaces. Waveguides are separately optimized for Tx and Rx operation. After QC, waveguide strips with board edge connectors are precisely aligned & mounted on substrates. Components are flip chip bonded over the I/O mirrors. (read more)
Pick-And-Place Circuit Assembly Contract Services
Employing automated pick-and-place electronic assembly equipment, Electrasem's contract manufacturing capabilities range from small prototype runs to medium volume assembly. Standard component sizes range from the 0402 chip to PLCC 84, measuring 1 inch. Quad Vision systems provide fine pitch placements. Cleaning is provided in a closed-loop filtration de-ionization system. (read more)
SMT Assembly Services
SenDEC has over 20 years of SMT (surface mount technology) expertise for you to leverage. Although the equipment and processes have changed over these years, one thing has not - their commitment to your project. (read more)
Electrical and Electromechanical Assembly Services
GRT-Mars offers a full range of electronic assembly services, both domestically and in Asia. Our in-house engineering talent is a great asset in this area, providing pre- and post-production support that ensures that quality and schedules are both maintained. Our Asian manufacturing facilities have decades of experience in manufacturing electronic assemblies using a variety of techniques... (read more)
NTB SERIES ANTI-BACKLASH LEAD SCREW ASSEMBLY
Allows OEMs to Use Fewer Parts at a Reduced Assembly Time (read more)
Cable Assemblies, Long-length HDMI Cable Assembly
Getting the HDMI digital video signal from point A to point B doesn't have to be as hard as it seems. L-com Connectivity Products now offers a line of HDMI products that extend your video signal with minimal effort. This includes HDMI cables and more. (read more)
Electrical & Electronic Assembly . . .
GRT-Mars offers a full range of electronic assembly services, both domestically and in Asia. Our in-house engineering talent is a great asset in this area, providing pre- and post-production support that ensures that quality and schedules are both maintained. (read more)
Chip on Board (COB) Assembly
On electronic designs, Chip-On-Board (COB) allows more functions to put in the same amount of space to achieve miniaturization of volume and weight. (read more)
Assembly Services and Capabilities
Mettrix Technology provides a full range of electronic assembly services from prototyping to medium quantity production runs of up to 10,000 pieces or more depending on the type of assembly required. (read more)
Conduct Research
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Techical Article: Technology - CMOS Gate Arrays
Thin Film RCs & RCDs Integrated thin film resistor capacitor diode network termination products are built on silicon substrates. USI's thin film resistors, capacitors and diodes are fabricated using...(read more)
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Xilinx WP208 Flip-Chip Package Substrate Solder Issue white... Virtex-II and Virtex-II Pro Families R WP208 (v1.1) January 14, 2004 Flip-Chip Package Substrate Solder Issue By: Abhay Maheshwari and Austin Lesea See Xilinx, Inc. Information |
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XAPP426: Implementing Xilnx Flip Chip BGA Packages 1 R Implementing Xilinx Flip-Chip BGA Packages Copper Heatspreader Thermal Interface Material Underfill Epoxy Flip Chip Solder Bump Adhesive Epoxy* See Xilinx, Inc. Information |
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August 2002 EEELinks Assessment of Flip-Chip Advanced Test Assembly Electronics Packages Under Extreme Temperature Applications |
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Application Note 1281 Bumped Die (Flip Chip) Packages Bumped Bumped Die (Flip Chip) National Semiconductor Application Note 1281 Packages April 2004 Die Table of Contents (Flip Introduction and Package See National Semiconductor Information |
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Press Release - INDUSTRY CONSORTIUM SIGNS DEAL WITH ARPA FOR... SANTA CLARA, CALIF., August 17, 1995 --The Low Cost Flip Chip Consortium has signed a $21,097,981 agreement with The Department of Defense's Advanced See National Semiconductor Information |
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Assembling High-Lead (Pb) DS2761 Flip-Chips in a Pb-Free... (RoHS). Because of these regulations, assembly processes must become lead-free (Pb-free). Although the DS2761 flip-chip die are exempt from the RoHS See Maxim Integrated Products, Inc. Information |
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Low thermal resistance assembly for flip chip applications... Low thermal resistance assembly for flip chip applications -> Monitor Keywords Low thermal resistance assembly for flip chip applications |
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Flip-chip type assembly invention Flip-chip type assembly USPTO Application #: 20070080454 Title: Flip-chip type assembly Flip-chip type assembly -> Monitor Keywords |
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Study of RF flip-chip assembly with underfill epoxy 1998 7th International Conference on Item Title: Study of RF flip-chip assembly with underfill epoxy Shortened Title: Multichip modules and high |
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Underfill encapsulant technology for flip chip assembly Underfill encapsulant technology for flip chip assembly |
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