Integrated circuit packaging is the final stage of semiconductor device fabrication in which the bare die or bare boards are placed inside of a protective packaging that provides connectors or pins for connecting to other devices.

Flip-flops are digital logic devices that synchronize changes in output state (1 or 0) according to a clocked input

RF and wireless chips are integrated circuits (IC) that are designed specifically for radio frequency (RF), microwave, and other wireless communications or data transmission applications

FLASH memory chips offer extremely fast access times, low power consumption, and relative immunity to severe shock or vibration. They do not need a constant power supply to retain their data. 

Dynamic random access memory (DRAM) chips are single-transistor memory cells that use small capacitors to store each bit of memory in an addressable format that consists of rows and columns. Because capacitors are unable to hold a charge indefinitely, DRAM memory chips require a near-constant pulse of current to retain stored information

Static random access memory (SRAM) chips do not need to be refreshed like DRAM chips. This makes SRAM chips faster and more reliable

Electronics assembly service companies based on providing contract design, manufacturing, and related product support services on behalf of electronics OEMs.

IC sockets and interconnect components interface or connect a microelectronic semiconductor chip to a board or larger scale device

Digital decoders and digital demultiplexers move data between inputs and outputs. In the case of digital decoders, the coded information is translated into familiar or uncoded formats, while digital multiplexers transmit data from one input through to several output lines. 

Complex programmable logic devices (CPLDs) are integrated circuits (ICs) or chips that application designers configure to implement digital hardware such as mobile phones. CPLDs can handle significantly larger designs than simple programmable logic devices (SPLDs), but provide less logic than field programmable gate arrays (FPGAs

Circuit protection devices are used to protect electronic components from unwanted transients such as current and voltage surges, electrostatic discharge (ESD), lightning, spikes and other signals that can imperil the operation or damage the component.

Monostable multivibrators, also known as one-shots, are digital devices similar to flip-flops, but with only one stable state where they remain until triggered by an input signal. Once triggered, the output is switched to the opposite state

Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.

Metal oxide varistors (MOV) are semiconductors that protect electronic components and systems from transient voltages.

Thermal management design and analysis services perform tests and redesigns around thermal dissipation issues.