Semiconductor metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. They include capacitance gages, C-V systems, electron beam probes, ellipsometers, interferometers, I-V system, magnetometers, optical systems, profilometers, reflectometers, resistance probes, RHEED systems, and X-ray diffractometers.  

Flexible circuits use polyimide films and other foldable substrates to meet the requirements of complex electronic manufacturing applications.

Environmental exposure (climatics) testing services use humidity, pressure, temperature, vibration, exposure to ultraviolet light (UV) and other climatic variables to test samples, parts and components, and finished products.

Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.

Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.

Specialized or proprietary products and accessories related to the manufacture of electronic or semiconductor components.

Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.

Conformal coatings encapsulate circuit boards and their electronic components in order to prevent the ingress of moisture, fungus, dust and other environmental contaminants.

Semiconductor wet process equipment performs a variety of wet processing applications including etching, washing, chemical mechanical polishing (CMP), and spin coating in semiconductor or microelectronics manufacturing

Integrated circuit packaging is the final stage of semiconductor device fabrication in which the bare die or bare boards are placed inside of a protective packaging that provides connectors or pins for connecting to other devices.

Semiconductor cluster tools and equipment are used to process semiconductor wafers for the production of microelectronic components

Environmental test chambers and rooms are used to ensure the reliability of industrial products, especially electronic items, through prolonged exposure to one or more environmental parameters.

Electronics assembly service companies based on providing contract design, manufacturing, and related product support services on behalf of electronics OEMs.

Electrical insulation and dielectric materials surround and protect electrical conductors such as wires and cables. They also prevent unwanted current flow or leakage.

Thin film materials are high purity materials and chemicals such as precursor gases, sputtering targets or evaporation filaments used to form or modify thin film deposits and substrates.