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Keep current on the latest products, new suppliers, and technical articles of interest to you. (See Topics) |
Products/Services for silicon back grinding
...in prototype to production quantities. Some companies produce silicon wafers for analog devices, application-specific integrated circuits (ASIC), high voltage components, logic gates, microprocessors, or computer memory. Others fabricate chips and wafers... Search by Specification | Learn More about Semiconductor Foundry Services
Precision grinding services perform operations such as centerless grinding, creep feed grinding, double-disc grinding, internal grinding, external grinding, jig grinding, surface grinding, and thread grinding. Search by Specification | Learn More about Precision Grinding Services
Grinders and grinding machines use an abrasive that is bonded to a wheel, belt or disc to remove material and improve surface finish. Search by Specification | Learn More about Grinders and Grinding Machines
Grinding wheels are used for metal removal, dimensioning, and finishing. They consist of an integral shank, pin, shaft, or mandrel that drives a mounted wheel or blades. Search by Specification | Learn More about Grinding Wheels
Bonded abrasives consist of conventional abrasive grains held together in a matrix of glass, resin, rubber or other binders. This classification includes grinding wheels, cut-off wheels, honing stones, mounted points and grinding segments. Search by Specification | Learn More about Bonded Abrasives
Back-up rings or anti-extrusion rings are washer-like devices used to prevent seals from extruding through gaps while under pressure. Seals are installed in the downstream side of the gland. Search by Specification | Learn More about Back-up Rings
Surface grinding segments are bonded abrasive structures that can be assembled on a special form to create a large wheel for flat surface grinding. Search by Specification | Learn More about Surface Grinding Segments
Abrasive, grinding and finishing accessories include holders, back-up pads, mandrels, contact wheels, polishing naps and other components used to apply abrasive products. Learn More about Abrasive Holders and Accessories
Centerless grinding services perform a machining operation in which an abrasive wheel grinds metal from a bar surface while a regulating wheel forces the bar against the grinding wheel. Search by Specification | Learn More about Centerless Grinding Services
Some abrasives and abrasive products are designed for use on bench or back stand grinders, while others are designed for use on portable or handheld grinders or sanders. Bonded abrasives, which include grinding wheels, use abrasive grains held... Search by Specification | Learn More about Abrasives and Abrasive Products
Abrasive belts consist of abrasive grain adhered onto the surface of a cloth, film, paper, non-woven or other backing. Search by Specification | Learn More about Abrasive Belts
Superabrasives and diamond wheels include grinding wheels, abrasive saw blades, wheel dressers, single-point tools, and other products that use diamond or cubic boron nitride (CBM) abrasive grains. Search by Specification | Learn More about Superabrasives and Diamond Wheels
Tool grinding services manufacture, recondition, regrind, and provide special profiling for cutting and machining tools. Search by Specification | Learn More about Tool Grinding Services
Abrasive discs consist of abrasive grain adhered onto the surface of a cloth, film, paper, non-woven or other backing. They are used for metal removal, surface finishing, sanding, etc. Search by Specification | Learn More about Abrasive Discs
Ball milling and grinding media are designed for ball milling and the grinding down of bulk, powder or granular materials into finer powder forms or disperse pigments in a resin or coating. Search by Specification | Learn More about Ball Milling and Grinding Media
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Sputtered PVD Metals available for Silicon Wafers Rogue Valley Microdevices, Inc.
Forming Gas and Nitrogen Annealing Available Rogue Valley Microdevices, Inc.
Low Stress LPCVD Nitride - Tensile Stress <250 MPa Rogue Valley Microdevices, Inc.
Silicon Wafers Available with Thin Films Rogue Valley Microdevices, Inc.
Accredited DoD Categroy 1A Trusted Foundry TriQuint Semiconductor, Inc.
Low Stress LPCVD Nitride - < 250 MPa Tensile Rogue Valley Microdevices, Inc.
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Product News for silicon back grinding
Norton FastCut Silicon Carbide Fiber Discs
Non-loading Swirl Pattern design, with cooling vents . . . combined with high quality, long lasting silicon carbide . . . provides a superior surface preperation and stock removal without clogging. Ideal for demanding right angle grinder jobs, at comfortable low angles . (read more)
Blanchard Style Rotary Grinder IG 280 SD
Blanchard grinding benefits for large part, mid and high volume applications. The programmable control saves grind parameters by part name for repeatable process automation. The servo driven z-axis delivers true feed rates and repeatable positioning. (read more)
OD/ID Grinder Debuts at Gear Expo
Bourn & Koch debuts new "Composite Platform" products for turning, hard finishing, OD/ID grinding and gear shaping at Gear Expo in Indianapolis, Indiana in September. (read more)
Auto Infeed Thrufeed Centerless Grinder
What makes the GT-610 Centerless grinder unique is the use of the 8-5/8" *(219mm) wide grinding wheel, equipped with super precision hollow roller bearings, which results in more efficient cutting, superior surface, longer dress and wheel life. (read more)
Single Disc & Double Disc Grinding Machines
Lapmaster, offers a complete line of double disc & single disc grinding machines. These high production, thru-feed/ plunge grind systems satisfy the tightest tolerance control for part to part size, parallelism, flatness & surface finish. Automatic load/unload systems, in-line deburring systems & a patented post grind 100% part inspection system are all available options. (read more)
4.5 Inch Right Angle Sander/Grinder
Right Angle Sander/Grinder, Size 4 1/2 In, No Load RPM 10,000, Amps @ 120V 10, Cord 8 Ft 2 Conductor, Spindle Thread Size 5/8-11 In, Features 3-Position Side Handle, Multi-Port Exhaust, Epoxy Coated Motor, Tool-Free Guard, Tool Length 14 In, Tool Weight 4.5 Lb, Bearing Ball and Needle Bearing (read more)
Model 18 Automated Wash & Grind Deburring Machine
The Redin Model 10/18 Automatic Load Wash & Grind is a machine used to deburr gears and sprockets of different diameters and widths. Redin Corporation has integrated the part washing into the deburring cycle. This wash cycle will remove cutting oils, lapping compounds and many other contaminants. (read more)
Weldon Phoenix Single/Dual Spindle ID CNC Grinder
The Phoenix ID Grinder is Weldon's compact ID Grinder. The Phoenix can automatically grind diameters, tapers, chamfers, radii, shoulders, and contours in one set-up and one continuous operation using a GE Fanuc CNC control.
The Dual Spindle option offers the possibility to grind two different surfaces in one setup or accomplish a rough and finish grind in a single chucking. The grinder... (read more)
Weldon P175 CNC Punch Grinder
The Weldon P175 CNC Punch Grinder has been specifically designed for non-round grinding of small parts such as pharmaceutical, sheet metal and forming punches. This extremely stiff, compact machine is manufactured with a 7" swing capacity and 7" distance between centers. Weldon has packaged the technology required to meet the stringent criteria associated with punch grinding. As a high precisio... (read more)
Weldon Automated Gear Shaft OD & Face Grinder
Application: Gear Shaft OD and Face Grind
Notable: Full turnkey for family of 19 (nineteen) part numbers with minimal change-over; grinder, tooling, gaging, blow off, safety enclosure, light curtains, robotic tending.
Process: Fully automatic formed wheel plunge grind of multi-diameters and shoulder... (read more)
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Modern Machine Shop Online - Grinding Forum See Modern Machine Shop Information |
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Silicon Wafer Backside Thinning with Mechanical and Chemical... |
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Mark V 8" Silicon Carbide Wet or Dry C W... from Amazon.com Mark V 8" Silicon Carbide Wet or Dry C Weight Grinding Discs, Plain Back, 600 grit, 100/Pkg. |
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Bimetal Thermometer, Steel Bimetal Thermometer Size 5 In, 0 to 250 F - 12 In. - Back, APPROVED VENDOR 1NGE5 Thermometer, Dial Size 5 In, 0 to 250 F - 4 In. - Back, APPROVED VENDOR 1NGE6 See Grainger Industrial Supply Profile & Catalog |
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Untitled providing a silicon wafer having a front side and a back side; thereafter removing substrate from the back side of the silicon wafer; |
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ICROS backgrinding wafer tape > Semiconductor and... ICROS® TAPE is used to manufacture integrated circuits as a surface protective tape in the silicon wafer back-grinding process. See Mitsui Chemicals America, Inc. Information |
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Mirror - Wikipedia, the free encyclopedia Copper is added for long-term durability.[13 The paint protects the coating on the back of the mirror from scratches and other accidental damage. |
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www.iitp.net - Shinhan Diamond Industrial Co., Ltd. - SILICON... and bonding matrix, the Silicon Wafer Back Grinding Wheel of SHINHANDIAMOND has achieved superior qualty of silicon wafer back. |
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Intersurface Dynamics Inc. - Back Grinding and Back Lapping Back Grinding and Back Lapping Removal of silicon from the backside of a wafer yields a thinner IC for thinner packaging. See Intersurface Dynamics Information |
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Mater. Res. Soc. Symp. Proc. Vol. 970 ? 2007 Materials... Since mechanical grinding has no selectivity between silicon and oxide, the grind-back was stopped at about 75 ?m away from the BOX layer. See Materials Research Society Information |
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