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...in prototype to production quantities. Some companies produce silicon wafers for analog devices, application-specific integrated circuits (ASIC), high voltage components, logic gates, microprocessors, or computer memory. Others fabricate chips and wafers... Search by Specification | Learn More about Semiconductor Foundry Services
Consequently, these materials are used in wet and dry grinding, sanding, cleaning, polishing, and surface preparation in a variety of industries, including metalworking, woodworking, ceramics, and semiconductors. The type of backing, abrasive grain, grit size... Search by Specification | Learn More about Abrasive Sheets, Rolls and Hand Pads
...compounds; and polishing compounds, stainless steel polishing compounds, and cultured marble polishing compounds. Other types of finishing compounds are also available. Finishing compounds may be specific to a particular machine or type of machine... Search by Specification | Learn More about Finishing Compounds
Aluminum oxide, the most common industrial mineral in use today, is used either individually or with other materials to form ceramic grains. Other types of abrasive grains include silicon carbine, alumina-zirconia, cork, and aggregate materials. Super... Search by Specification | Learn More about Abrasive Belts
Buffing and polishing services perform smoothing operations that change a metal's surface appearance. These operations can be for aesthetic and/or functional purposes. Search by Specification | Learn More about Buffing and Polishing Services
Coated abrasives are used for abrading, smoothing, or polishing. Search by Specification | Learn More about Coated Abrasives
...types of abrasive grains include garnet, tungsten carbine, silicon carbide, and alumina-zirconia. Super-abrasive diamond pastes are useful in ferrous polishing or lapping applications where heat and reactivity are not a factor. Cubic boron nitride (CBN... Search by Specification | Learn More about Abrasive Discs
...and grinding or ball milling. Other abrasive products are designed for peening, polishing or lapping, and tumbling or mass finishing applications. Typically, tumbling and mass finishing media is used to deburr, burnish, color, descale, polish, or clean... Search by Specification | Learn More about Abrasive Grain and Finishing Media
...individually or with other materials to form ceramic grains. Aluminum oxide is also combined with emery and crocus to produce abrasives suitable for finishing applications. Other types of abrasive grains include garnet, tungsten carbine, silicon... Search by Specification | Learn More about Abrasives and Abrasive Products
...for finishing applications. Silicon carbine, a synthetic abrasive that is harder than aluminum oxide, is used typically with nonferrous materials such as brass, aluminum, and titanium. Alumina-zirconia grains fuse aluminum oxide and zirconium oxide... Search by Specification | Learn More about Flap Wheels and Specialty Abrasives
Tumbling and mass finishing media is used to debur, burnish, color, de-scale, polish or clean during finishing processes. Search by Specification | Learn More about Tumbling and Mass Finishing Media
Lapping services uses a free abrasive machining process, which produces finished components without introducing stresses and heat damage associated with other processes. Search by Specification | Learn More about Lapping Services
...microelectronic devices and optoelectronic devices such as transistors, photodetectors and solar cells. Silicon (Si) is the most commonly used semiconductor material today; however, other semiconductor material types are also available. The number of valence... Learn More about Semiconductors and Semiconductor Materials
, stripping or coating removal, and ultrasonic cleaning. Finishing processes include blasting, buffing, deburring, deflashing, polishing, electropolishing, honing, mass finishing, mirror finishing, oxygen cleaning, passivation, picking, sanding Search by Specification | Learn More about Surface Preparation Services
...bores. Special honing tools configurations are available for honing cylindrical surfaces and other specialized shapes. Sharpeners and sharpening stones use several different types of abrasive grains. Examples include aluminum oxide, silicon... Search by Specification | Learn More about Sharpeners and Sharpening Stones
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Low Stress LPCVD Nitride - < 250 MPa Tensile Rogue Valley Microdevices, Inc.
Turn Key wafer fab capabilities Universal Semiconductor, Inc.
Silicon Wafers Available with Thin Films Rogue Valley Microdevices, Inc.
TriQuint Opens Industry's 1st GaN Foundry Service TriQuint Semiconductor, Inc.
USI Photonics - Micro-Optical Solutions Universal Semiconductor, Inc.
Sputtered Metals including Cu, Al, and Ni Rogue Valley Microdevices, Inc.
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Res-Kem's white paper on water treatment entitled "Condensate Polisher Savings Of 23% Realized Through Value Engineering" shows how a well-known university, as part of a value engineering team, working closely with a knowledgeable water treatment equipment supplier and mechanical contractor, realized a condensate polisher capital cost savings of 23%, substantially improving the ROI. (read more)
Fischer Connectors, Inc. offers the industry's first fiber optic HDTV Broadcast Camera Connector that meets the broadcast industry's requirements for an effortless transition to fiber based HDTV cameras. (read more)
Rogue Valley Microdevices is pleased to offer PECVD Silicon Carbide. This highly durable thin film can be deposited alone or within stack of PECVD Oxide and/or Nitride films. PECVD Silicon Carbide is the perfect choice for use as a hard mask for bulk micromachining. Rogue Valley Microdevices process all wafers and films in-house at our Medford, Oregon facility. (read more)
Rogue Valley Microdevices offers PECVD Silicon Carbide, which is a single side deposition. This highly durable thin film can be deposited alone or within stack of PECVD Oxide and/or Nitride. PECVD Silicon Carbide is the perfect choice for use as a hard mask for bulk micromachining of your finished wafers. We are able to process wafer diameters of 50mm up to 300mm. (read more)
Rogue Valley Microdevices offers PECVD Silicon Carbide (SiC), which is a single side deposition. This highly durable thin film can be deposited alone or within stack of PECVD Oxide and/or Nitride. PECVD Silicon Carbide is the perfect choice for use as a hard mask for bulk micromachining of your finished wafers. We are able to process wafer diameters of 50mm up to 300mm. (read more)
Silicon Wafers - Because of our ability to process all wafers diameters (50mm-300mm) Rogue Valley Microdevices maintains a diverse inventory for customers whom require either bare silicon wafers or silicon wafers with Thin Films. Our ability to provide you with both thin films services and silicon wafers can help reduce cycle time as well as shipping cost. (read more)
Pacific Silicon Sensor in association with Silicon Sensor, GmbH, announce a new line of silicon PIN photodiodes, the "-6B Series". Enhanced for use in the 400-600nm range with QE >70% at 410nm and >85% at 532nm, these low capacitance and ultra-low dark current devices are a superior choice for eye response,visible bandpass filter & scintillation crystal applications. (read more)
Silicon Wafers - Because of our ability to process all wafers diameters (50mm-300mm) Rogue Valley Microdevices maintains a diverse inventory for customers whom require either bare silicon wafers or silicon wafers with Thin Films. Our ability to provide you with both thin films services and silicon wafers can help reduce cycle time as well as shipping cost. (read more)
Silicon Wafers - Because of our ability to process all wafers diameters (50mm-300mm) Rogue Valley Microdevices maintains a diverse inventory for customers whom require either bare silicon wafers or silicon wafers with Thin Films. Our ability to provide you with both thin films services and silicon wafers can help reduce cycle time as well as shipping cost. (read more)
There are several important advantages to bearing performance that are due to the improved surface characteristics of silicon nitride balls. Because the microstructure of silicon nitride can be uniformly engineered to sub-micron grain size, the surface of a silicon nitride ball can be finished to <0.15 micro-inch Ra and the roundness is often better than 0.00001 tolerance. This precision res... (read more)
| Part # | Distributor | Manufacturer | Product Category | Description |
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| LC-0400VF-16 | Amazon | Clover | BISS | Clover Lapping Compound-Silicon Carbide, Very Fine (Fine Polishing & Clover Lapping), 400 Grit, 1 Pound Can |
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Silicon Wafers Silicon, SOI, silicon on insulator, glass, germanium, deposition, thin films, oxide, nitride, TiN, Wti, Al, Al alloys, Cu, W, Cr, Ni, NiV7, TaN, Ti, See Polishing Corporation of America Information |
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Montco Silicon Technologies, Inc. -- Silicon Wafer... Our companies offer quality Semiconductor Silicon from 2? through 300mm and a full line of in-house services. See Montco Silicon Technologies, Inc. Information |
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Chemical Mechanical Polishing of Silicon Carbide Chemical Mechanical Polishing of Silicon Carbide |
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Optical polishing, lapping, dicing and optical components... Optical polishing, CMP polishing, optical waveguide edge and optical angle polishing, wafer dicing and substrate dicing, backgrinding, flat lapping |
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SEMI M48-1101 Guide for Evaluating Chemical-Mechanical... |
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Polishing composition and method for high silicon nitride to... Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios -> Monitor Keywords |
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IBM Technical Journals Vapor-Phase Polishing of Silicon with H2–HBr Gas Mixtures Related Subjects: Materials technology; Silicon |
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IBM Technical Journals Vapor-Phase Polishing of Silicon with H2–HBr Gas Mixtures |
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Silicon wafer producers and suppliers - Where to buy silicon... Cemat Silicon S.A. Cemat Silicon S.A., 133 Wolczynska St., 01-919, Warsaw, Poland e-mail: Marketing &Sales, |
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Silicon wafers silicon wafer Silicon Inc. Prime and Test silicon wafers. Also, we have available reclaiming services (etching, polishing and silicon wafer cleaning). See Silicon, Inc. Information |