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Welcome to GlobalSpec - a trusted source for engineers and industrial professionals.
Search GlobalSpec to find wafer bonding-related products, suppliers, datasheets and CAD.
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Product Alerts
Keep current on the latest products, new suppliers, and technical articles of interest to you. (See Topics) |
Products/Services for wafer bonding
...equipment; semiconductor tooling; equipment for material handling, wafer measurement, and wafer preparation; test equipment; and vacuum equipment. By definition, semiconductor wafers are thin slices of semiconductor materials used in the fabrication... Learn More about Semiconductor Equipment Repair Services
...oxidation and diffusion, packaging and backend processing, photolithography, screen-printing, wafer bonding, and wet and chemical etching. Search by Specification | Learn More about MEMS Foundry
Instruments such as quartz crystal microbalance (QCM) monitors, ellipsometers, RHEED systems, imaging stations, CD-SEMs, ion mills, C-V systems specifically designed for wafer metrology or in-situ monitoring of thin film Search by Specification | Learn More about Wafer and Thin Film Instrumentation
...pins. IC packaging tape is used to stock ICs so that they can be handled. Electronic packaging materials include wafer and substrate bumping pastes, sphere attach fluxes, ultra-spheres (solder spheres), reflow encapsulants (no flow underfills... Learn More about Electronic and IC Packaging Services
Foam bonding tapes are specialized tapes designed for adhesive joining of foam materials. Search by Specification | Learn More about Foam Bonding Tapes
Ground bond testers are electrical safety test devices that perform electrical compliance tests. Search by Specification | Learn More about Ground Bond Testers
Semiconductors (metalloids) or semiconductor materials are used to fabricate microelectronic and optoelectronic devices such as transistors, photodetectors or solar cells. Learn More about Semiconductors and Semiconductor Materials
Frame grabbers are image processing computer boards that capture and store image data for industrial applications such as quality control. Search by Specification | Learn More about Frame Grabbers
Semiconductor metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. They include capacitance gages, C-V systems, electron beam probes, ellipsometers, interferometers, I-V system Search by Specification | Learn More about Semiconductor Metrology Instruments
Machine vision systems are used for automated inspection and measurement in production environments. Search by Specification | Learn More about Machine Vision Systems
Specialty cement, concrete and mortar contain specialized binders such as K silicate, calcium aluminate, sulfur, and oxysulfate or polymer resins. They cure or set through film drying (air setting), chemical reactions, thermoset bonds Search by Specification | Learn More about Specialty Cement, Concrete and Mortar
Optical windows are used to isolate different physical environments while allowing light to pass relatively unimpeded. Search by Specification | Learn More about Optical Windows
Industrial tapes are used for adhesive bonding, thread sealing, masking, packaging, wrapping, electrical insulation, ESD control and other specialized applications. Search by Specification | Learn More about Industrial Tapes
...resinoid, and plastic bonding systems as well as products with rubber or elastomer bonds. Metal bonds between the abrasive grains and between the grains and a metal substrate are also available. Metal bond systems are used mainly for superabrasive... Search by Specification | Learn More about Cutoff Wheels and Abrasive Saw Blades
...carry specifications for bond type, features, and mounting style. There are three main bond types: metal, resin or resinoid, and vitrified. Features for superabrasives and grinding wheels include slotted blades, slicing blades, and low or high... Search by Specification | Learn More about Superabrasives and Diamond Wheels
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Micralign Technical Training Beta Squared Lithography, Inc.
Failure Analyses ANALYZE Inc.
Audio Product and Device Testing Services ATECS Audio Test Engineering Consulting Services, Inc.
Other Product & Component Testing Services Accutek Testing Laboratory
Shock and Vibration Testing Services E-Labs, Inc.
IECEx Repair Facility Certification Underwriters Laboratories
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Product News for wafer bonding
High Pressure Thermal Bonding System
Automatically process 4 wafers with ± 0.5°C uniformity and ±1 PSI pressure.
Accepts and tracks pre-processed wafers via manual or shuttle loading system. Machine confirms wafer presence and orientation, then applies controlled heat and pressure over specified time period in one of four press chambers in the machine. (read more)
Ultra High Precision Wafer Attach Machine
Attach small, thin components to wafer with better than 1 micron accuracy, 99.9% quality, and self-inspection in 1.25 seconds.
This machine attaches small, thin components to the surface of a wafer using vision-guided servo control, 2 robots, a high performance stack of stages (X, Y, Theta), 4 vision cameras, and 2 vision boards. (read more)
Strong UV Adhesive Forms Resistant Bonds
An innovative UV adhesive combines high strength bonds with the well established benefits of light curing compounds, including high productivity, improved performance and environmental compliance. Recommended for clear coating, sealing and bonding and simplifies any process that requires critical alignment or exact positioning. (read more)
Dontech Introduces IMO-bond™ Optical Bonding
Dontech's IMO-bond™ process is ideal for enhancing electronic displays that are commonly used in outdoor and high ambient light applications such as GPS and instrumentation systems used in marine, avionic, military, medical, and industrial environments. (read more)
PECVD SiC Thin Film for Silicon Wafers
Rogue Valley Microdevices offers PECVD Silicon Carbide (SiC), which is a single side deposition. This highly durable thin film can be deposited alone or within stack of PECVD Oxide and/or Nitride. PECVD Silicon Carbide is the perfect choice for use as a hard mask for bulk micromachining of your finished wafers. We are able to process wafer diameters of 50mm up to 300mm. (read more)
PECVD Silicon Carbide (SiC) Film for 2"-12" wafers
Rogue Valley Microdevices is pleased to offer PECVD Silicon Carbide. This highly durable thin film can be deposited alone or within stack of PECVD Oxide and/or Nitride films. PECVD Silicon Carbide is the perfect choice for use as a hard mask for bulk micromachining. Rogue Valley Microdevices process all wafers and films in-house at our Medford, Oregon facility. (read more)
Dry Thermal Oxide available for Silicon Wafers
Rogue Valley Microdevices offers Dry Thermal Oxide. Our ultra pure Dry Oxidation process is available for those applications requiring thinner oxides. We offer Chlorinated and Non-Clorinated Dry Thermal Oxide. Using Dry Chlorinated Thermal Oxide can help your devices perform to their highest potential by eliminating metal ions. (read more)
Silicon Wafers Available with Thin Films
Silicon Wafers - Because of our ability to process all wafers diameters (50mm-300mm) Rogue Valley Microdevices maintains a diverse inventory for customers whom require either bare silicon wafers or silicon wafers with Thin Films. Our ability to provide you with both thin films services and silicon wafers can help reduce cycle time as well as shipping cost. (read more)
Silicon Wafers Available
Silicon Wafers - Because of our ability to process all wafers diameters (50mm-300mm) Rogue Valley Microdevices maintains a diverse inventory for customers whom require either bare silicon wafers or silicon wafers with Thin Films. Our ability to provide you with both thin films services and silicon wafers can help reduce cycle time as well as shipping cost. (read more)
Optical Bonding of Flat Panel Displays
Improves optical performance, durability, and a displays' ability to resist shock, vibration and moisture. (read more)
Conduct Research
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Thermal Design Considerations for High-Power Single-Chip LEDs
With advanced high-power packaging technology, large-area chips offer a number of advantages over arrays, according to Bob Karlicek, John Graff and Dave Sciabica.For general illumination, conventional...(read more)
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Failure Analysis of Die Bond Adhesion Failures Caused by Silicone Contamination
This paper presents a case history of a failure analysis performed on a die bond adhesion failures. Silicone contamination caused intermittent adhesive failures at the die back...(read more)
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Wafer Backside Coating of Die Attach Adhesives
Traditionally, the most common types of die attach materials used in the semiconductor industry have been solder or adhesive. Both have been applied to the substrate, immediately before die attach....(read more)
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GaAs-Based Surface Mount Wafer Scale Package MMICs for DC to 45 GHz Applications (.pdf)
Packaging has always been the "Achilles Heal" of extracting the maximum microwave performance out of any IC technology. The inherent parasitic capacitance and inductance associated with bond wires,...(read more)
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Packaging microscopic machines
Although MEMS technology is considered fundamentally ready for prime time, packaging hasn’t kept pace. But that’s changing as an estimated 900 packaging patents will be filed this year...(read more)
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Residual Stress Instruments
Structure or residual stress instruments are capable of discerning microstructural, chemical bond type, or structural features of wafer or thin film deposits. Microstructural features include phase...(read more)
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Optical Fiber Array With Precise Fiber Positioning
Optical fiber array apparatus comprising housing front mask having a matrix of fiber seating openings each opening having one or more side walls. An optical fiber extends through each opening and...(read more)
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TA017: Development of a High Voltage mmW GaAs PIN Diode Switch
The initial development of a three pole three throw, (3P3T), switch for 35 to 40 GHz applications on the surface was thought to be a straightforward frequency scaled adaptation of a previously...(read more)
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Mater. Res. Soc. Symp. Proc. Vol. 970 ? 2007 Materials... Research Society 0970-Y04-08 3D Process Integration ? Wafer-to-Wafer and Chip-to-Wafer Bonding Thorsten Matthias1, Markus Wimplinger2, Stefan See Materials Research Society Information |
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Mater. Res. Soc. Symp. Proc. Vol. 970 ? 2007 Materials... etc. Using temporary adhesives to bond the processed device wafer to a rigid carrier wafer offers an efficient solution, and is becoming increasingly See Materials Research Society Information |
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Method and apparatus for wafer to wafer bonding invention Method and apparatus for wafer to wafer bonding -> Monitor Keywords Method and apparatus for wafer to wafer bonding |
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Method of wafer-to-wafer bonding invention Method of wafer-to-wafer bonding USPTO Application #: 20080070376 Title: Method of wafer-to-wafer bonding |
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Wafer Bonding - Surface Pressure Distribution and Magnitude Wafer Bonding Wafer Polishing Windshield Wiper See Sensor Products Inc. Information |
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SUSS MicroTec: Equipment for the Semiconductor Market Wafer Bonding for LEDs Applications Photolithography Wafer Level Packaging Wafer Bumping MEMS / Nanotechnology See SUSS MicroTec Inc. Information |
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Wire Bond, Gold Wire Bonder | Palomar Technologies Wire Bonding Chain Bonding Component Systems See Palomar Technological Companies Information |
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EETimes.com - Wafer-bonding technique yields new materials Wafer-bonding technique yields new materials See EE Times Information |
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Application Note: HFAN-8.0.1 Rev.1; 04/08 Understanding... |
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SPIE Newsroom 10.1117/2.1200703.0657 Using contact imprinting... imprinting for adhesive wafer-to-wafer bonding Liming Yu, Francis Eng Hock Tay, Daniel P. Poenar, and Ciprian Iliescu Bonding wafers via indirect |
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