Syagrus Systems' fully automated wafer dicing systems consistently meet the tight requirements expected in our industry and demanded by our customers. At Syagrus Systems they know that a good wafer dicing process sets the pace for all remaining operations. (read more)

The BLACKSTAR™ Series is a silicon dicing system utilizing a basic Fantom Laser Dicing Technology™ (FLDT™) invented and patented by Fonon Technology modified to accommodate the requirements of a composite wafer or PCB singulation process without affecting the existent dicing method, processes and procedures. (read more)

Today's technology companies continue to demand extremely thin silicon wafers and die for their complex applications. The Syagrus Systems team has over 12 years of silicon wafer thinning and wafer backgrinding experience. (read more)

Syagrus Systems offers automated wafer inspection services as well as the flexibility of manual wafer inspection services. Whether you have unsawn wafers, sawn wafers on frame or individual die, our trained staff can help you. Inspection personnel are trained to MIL STD 883 specifications. For products with less stringent requirements, a commercial grade die inspection is available. (read more)

Whether you require high volume production pick and place or a single wafer prototype build, Syagrus Systems has the die sorting solution for you. We have over 10 years experience in processing flip chip devices and our automated die sort systems have device invert capability, so your product is ready for automated manufacturing. Multiple output options are available. (read more)

Etched Foil Heaters for the Semiconductor & Wafers industries from Thermal Circuits. In the early 1980's, Thermal Circuits introduced HTB etched foil element heaters to the Semiconductor industry to heat acid in portable wafer processing baths. It replaced hot plates that only heated from the bottom. (read more)

Quik-Pak specializes in open-cavity plastic packages and assembly. (read more)

The Proforma 300 TM wafer thickness gage can be used to measure thickness, bow and TTV on all wafer materials including: silicon,gallium-arsenide,indium phosphide and germanium without recalibrating or electrically grounding the wafer. (read more)

Proforma 300/G - Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape. (read more)

Proforma^TM AutoScan 200 - Fully automated wafer characterization system for measuring thickness, TTV, bow, warp, bulk resistivity, site and global flatness. The Proforma AutoScan 200 features pick and place robotics, laser cassette scanning, auto-sensing cassette stands for wafers 75 - 200 mm diameter, and a modular design for easy upgrades. (read more)