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Semiconductor foundry services suppliers design and manufacture semiconductor chips on a contract basis, in prototype to production quantities. Search by Specification | Learn More about Semiconductor Foundry Services
Semiconductor cluster tools and equipment are used to process semiconductor wafers for the production of microelectronic components. Learn More about Semiconductor Cluster Tools
Semiconductors (metalloids) or semiconductor materials are used to fabricate microelectronic and optoelectronic devices such as transistors, photodetectors or solar cells. Learn More about Semiconductors and Semiconductor Materials
Instruments such as quartz crystal microbalance (QCM) monitors, ellipsometers, RHEED systems, imaging stations, CD-SEMs, ion mills, C-V systems specifically designed for wafer metrology or in-situ monitoring of thin film parameters during thin film or semiconductors wafer processing. Search by Specification | Learn More about Wafer and Thin Film Instrumentation
Thin film equipment uses vacuum processing for the modification of surfaces using CVD, PVD, plasma etching, and thermal oxidation or ion implantation. Search by Specification | Learn More about Thin Film Equipment
Semiconductor metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. They include capacitance gages, C-V systems, electron beam probes, ellipsometers, interferometers, I-V system, magnetometers, optical systems, profilometers, reflectometers, resistance probes, RHEED systems, and X-ray diffractometers. Search by Specification | Learn More about Semiconductor Metrology Instruments
Lithography equipment transfers circuit or device patterns onto a substrate using a patterned mask and a beam of light or electrons to selectively expose a photoresist layer. Overlay metrology systems align the pattern masks or reticules. Learn More about Lithography Equipment
Thin film materials are high purity materials and chemicals such as precursor gases, sputtering targets or evaporation filaments used to form or modify thin film deposits and substrates. Learn More about Thin Film Materials
Glass fabrication services is the manufacturing of glass parts and assemblies using blowing, casting, extrusion, drawing, pressing, heat shrinking or other fabrication processes. Search by Specification | Learn More about Glass Fabrication Services
Electronic packaging and integrated circuit packaging is the final stage of semiconductor device fabrication in which the bare die or bare boards are placed inside of a protective packaging that provides connectors or pins for connecting to other Learn More about Electronic and IC Packaging Services
Sheet metal fabrication services manufacture components by cutting, bending, rolling, forming, stamping, and welding sheet metal. Search by Specification | Learn More about Sheet Metal Fabrication Services
Optical manufacturing services design, fabricate, finish and test optical components and optical elements. Search by Specification | Learn More about Optical Manufacturing Services
MEMS devices integrate mechanical components, electronics, sensors and actuators on a semiconductor material, chip, or wafer. Learn More about MEMS Devices
Temperature instruments use contact or noncontact methods to measure temperature. Products include dial, digital, industrial and laboratory thermometers; temperature probes, indicators, and sensors; RTD elements and transmitters; and thermistors, thermocouples, thermopiles, and thermal switches. Search by Specification | Learn More about Temperature Instruments
Welding and fabrication services weld and fabricate a variety of materials. They may also perform services such as machining, CAD support, and field welding. Search by Specification | Learn More about Welding and Fabrication Services
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Sputtered Metals including Cu, Al, and Ni Rogue Valley Microdevices, Inc.
Can your foundry do this? Universal Semiconductor, Inc.
TriQuint Opens Industry's 1st GaN Foundry Service TriQuint Semiconductor, Inc.
Low Stress LPCVD Nitride - Tensile Stress <250 MPa Rogue Valley Microdevices, Inc.
TQBiHEMT GaAs Foundry Process TriQuint Semiconductor, Inc.
PECVD Oxide available up to 5um thick Rogue Valley Microdevices, Inc.
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PanJit offers full turn-key wafer fabrication or process specific services in their Tempe, Arizona, USA facility. These services include the following: TVS, ESD, Zener, Bipolar, Small Signal, Schottky, JFET, BJT. We also provide specialty films. Please contact us for more details. (read more)
Universal Semiconductor (USI) expands its Turn Key wafer fab capabilities to include 6" wafer now offering 2', 3", 4", 5" and 6" wafer foundry services.
USI's expanded lithography equipment includes new submicron ASML PAS 2500/40 Stepper Aligner, Spinners, Lam and Tegal Dry Plasma Etchers for up to 6" wfrs.
USI's expanded Metal Deposition and Diffusion processes provide a diverse range of s... (read more)
Etched Foil Heaters, for the Semiconductor & Wafer Processing industry, from Thermal Circuits. In the early 1980's, Thermal Circuits introduced HTB etched foil element heaters to the Semiconductor industry to heat acid in portable wafer processing baths. It replaced hot plates that only heated from the bottom. (read more)
For close to 15 years, clients have been relying on and partnering with Merit Sensor Systems, Inc. to design and manufacture component-level piezoresistive pressure sensor solutions for a variety of applications and industries.
We invite you to take a closer look (read more)
For your heavy, large fabrications, Pickwick Manufacturing Services offers a 45-ton and two 30-ton overhead cranes with 35 feet under hook inside our 100,000 s.f. facility. We maneuver and load the biggest fabrications, weldments and assemblies in any weather, allowing the safe, timely delivery that pleases your customers. (read more)
Large fabrications fit with ease into Pickwick Manufacturing Services 100,000 s.f. facility on 20 acres. With two 30-ton overhead cranes, 35 feet under hook, and a 45-ton crane, size and weight are handled safely in any weather. From engineering through finishing, Pickwick has the capabilities for these large fabrications. (read more)
The key to many of our customers' successes is their cutting-edge industrial technology; building the metal box it comes in is both a distraction and an unnecessary expense. Our technology is supplying that box and any other metal fabrications needed (read more)
Specialty custom machining of sapphire and ceramic wafers allows Insaco to respond to customer needs for nesting of wafers in larger carriers. (read more)
Rogue Valley Microdevices offers PECVD Silicon Carbide (SiC), which is a single side deposition. This highly durable thin film can be deposited alone or within stack of PECVD Oxide and/or Nitride. PECVD Silicon Carbide is the perfect choice for use as a hard mask for bulk micromachining of your finished wafers. We are able to process wafer diameters of 50mm up to 300mm. (read more)
Rogue Valley Microdevices is pleased to offer PECVD Silicon Carbide. This highly durable thin film can be deposited alone or within stack of PECVD Oxide and/or Nitride films. PECVD Silicon Carbide is the perfect choice for use as a hard mask for bulk micromachining. Rogue Valley Microdevices process all wafers and films in-house at our Medford, Oregon facility. (read more)
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Xilinx XCN05009 Addition of UMC 300 mm Wafer Fabrication for... Addition of UMC 300 mm Wafer Fabrication for Spartan-3 Family XCN05009 (v1.0.1) May 13, 2005 Product/Process Change Notification Overview The See Xilinx, Inc. Information |
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Product Change Notification PCN2001-06 Xilinx PCN2001-06 Additional equivalent wafer foundries for fabrication of VirtexTM-E commercial family Page 1 of 1 Xilinx PCN, PDNs, and Advisories See Xilinx, Inc. Information |
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Wafer Fabrication and Assembly / Test Pricing Report Wafer Fabrication Equipment Test, Assembly and Packaging See Electronics.ca Publications Information |
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main menu Wafer Fabrication Facilities home find: See Epson Electronics America, Inc. Information |
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Seagate Announces Multi-Million Dollar Wafer Fabrication Plant... Seagate Announces Multi-Million Dollar Wafer Fabrication Plant See Seagate Technology Profile & Catalog |
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Wafer Fabrication Wafer Fabrication Water and Waste Management See Technica, U.S.A. Information |
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Semiconductor Manufacturing - Wafer Fabrication - Overview Wafer Fabrication - Overview Main Index > Wafer Fabrication - Overview |
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Thin Film Silicon Patterning - Thin Film Glass Patterning -... Wafer fabrication and foundry processing services for silicon; Germanium; Glass (conductive); Sapphire; SOI; Alumina; Lithium Niobate; Sodium See Elume, Inc. Information |
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Semiconductors: Silicon: Non-Fabrication Processing: Wafer... Safety and Health Topics > Semiconductors > Non-Fabrication Processing: Wafer Sort and Test Non-Fabrication Processing: Wafer Sort and Test See Occupational Safety & Health Administration (OSHA) Information |
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Semiconductors - Definitions See Device Fabrication - Deposition. Deposition: A general term used to describe the addition of material layers on a semiconductor wafer. See Occupational Safety & Health Administration (OSHA) Information |