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About Semiconductor Foundry Services
Semiconductor foundry services design and manufacture semiconductor chips on a contract basis, in prototype to production quantities. Some companies produce silicon wafers for analog devices, application-specific integrated circuits (ASIC), high voltage components, logic gates, microprocessors, or computer memory. Others fabricate chips and wafers for oscillators, transistor-oscillators (TO), passive components, power electronics, sensors, or micro-electrical mechanical systems (MEMS). Semiconductor foundry services are located across North America and around the world. They manufacture semiconductors for a variety of market segments, including: aerospace, biotechnology, computers, telecommunications, and transportation. Chip manufacture for imaging or vision systems and wireless, radio frequency (RF) and microwave devices is also available.
Semiconductor foundry services perform processes such as chemical mechanical polishing (CMP), physical vapor deposition (PVD), chemical vapor deposition (CVD), screen printing, dry etching, wet etching, photolithography, wafer level packaging, and via forming or filling. CMP is used for the planarization of deposited structures. PVD deposits thin films by physical methods and includes techniques such as evaporation and sputtering. CVD is a thin-film deposition process in which gaseous chemical precursors form deposits of oxides, nitrides, dielectric ceramics or other complex compounds. Screen printing uses a metal paste or ink to form thick-film circuits or interconnects. Dry etching processes such as plasma or reactive ion etching (RIE) remove layers from or cut patterns into substrates. Wet etching also forms or cuts substrate patterns, but uses acids or other chemical solutions. Photolithography transfers a circuit pattern onto a substrate by using a patterned mask and beam of light to selectively expose a photoresist layer. Wafer level packaging uses solder bumping or redistribution line technology (RDL). Via forming and via filling creates patterned circuits or vias in a ceramic substrate for the interconnection of electronic components and packaging of dies.
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ASIC and Foundry Services : FUJITSU Canada ASIC / Foundry Services Semiconductor Manufacturing Services See Fujitsu Limited Information |
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Wafer Foundry Service : FUJITSU Malaysia an integrated semiconductor manufacturer, Fujitsu operates state-of-the-art foundry capabilities and offers a full turnkey of services covering not See Fujitsu Limited Information |
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Untitled Enhanced Foundry Services National Semiconductor's Enhanced Foundry Services (EFS) are tailored |
