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Flip chips are integrated circuits (ICs) that use a specific number of bumps to provide electrical and mechanical interconnections. Flip chips are designed for facedown mounting.
Vendors assemble devices that function as electrical-to-optical or optical-to-electrical transducers. They also assemble instruments that include these devices. Examples of optoelectronic devices include light emitting diodes (LEDs), injection laser diodes, and photodiodes that are used regularly in optical fiber communications.
Vendors assemble devices that function as RF or wireless transmitters, receivers or transceivers. They also assemble instruments that include these devices. Examples of RF and wireless devices include radio frequency identification devices (RFIDs), telecommunication devices, and other wireless devices that are used regularly in telecommunications and wireless data transfer systems.
Through hole technology (THT) mounts components on a PCB by inserting component leads through holes in the board and then soldering the leads in place on the opposite side of the board.
Surface mount technology (SMT) adds components to a PCB by soldering component leads or terminals to the top surface of the board. SMT components have a flat surface that is soldered to a flat pad on the face of the PCB. Typically, the PCB pad is coated with a paste-like formulation of solder and flux. With careful placement, SMT components on solder paste remain in position until elevated temperatures, usually from an infrared oven, melt the paste and solder the component leads to the PCB pads.
Industry-standard pick-and-place equipment can mount SMT components quickly, accurately, and cost-effectively. SMT is a widely used alternative to mounting processes that insert pins or terminals through holes and solder leads into place on the opposite side of the board. Surface mounted components are usually smaller than equivalent through-hole leaded devices and, in some cases, are also less expensive.
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Vendors can produce samples in a relatively short time. For example, quick-turn vendors can often assemble PCBs within 48 hour of receiving all board-level components.
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Vendors supply all of the materials for production.
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Computer-based, automated optical inspection analyzes an image of an in-process or completed PCB and locates defects such as broken traces, excess copper or solder, etching problems, and the misregistration of holes to the circuit pattern.
Environmental testing is a procedure that simulates the environmental conditions to which a product may be exposed. Temperature, humidity, and vibration tests are some examples.
In-circuit testing (ICT) is a procedure in which the circuit nodes of an assembly are accessed by pin-type probes to test individual components within the circuit.
X-Ray testing is a non-destructive technique that provides a thorough analysis of varying densities. Inspection of assemblies can be performed with submicron defect recognition.
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The American National Standards Institute (ANSI) is a private, non-profit organization that administers and coordinates the U.S. voluntary standardization and conformity assessment system.
The International Organization for Standardization (ISO) is a worldwide federation of national standards bodies from some 130 countries, one from each country. The mission of ISO is to promote the development of standardization with a view to facilitating the international exchange of goods and services, and to develop cooperation of intellectual, scientific, technological, and economic activity.
ISO 13485:2003 specifies quality management system (QMS) requirements for organizations that need to demonstrate their ability to provide medical devices and related services that consistently meet applicable customer and regulatory requirements. ISO 13485:2003 contains specific requirements for medical devices and excludes non-applicable requirements from ISO 9001. Consequently, an organization with a QMS that conforms to ISO 13485:2003 cannot claim to conformity to ISO 9001 unless the QMS meets all of ISO 9001’s requirements.
ISO 14001 specifies the actual requirements for an environmental management system. It applies to those environmental aspects, over which the organization has control or influence. ISO 14001 was first published in 1996 and is the only ISO 14000 standard against which it is currently possible to be certified by an external certification authority.
QS-9000 is a quality standard for suppliers of DaimlerChrysler Corporation, Ford Motor Company, and General Motors Corporation. QS-9000 is based on the 1994 edition of ISO 9001, but contains additional requirements that are particular to the automotive industry. Specifically, QS-9000 applies to suppliers of production materials, production and service parts, heat-treating, painting and plating, and other finishing services.
AS9100 is a standard from the International Aerospace Quality Group (IAQG) that contains over 70 unique requirements for aerospace and aviation. It also extends 18 requirements from ISO:9001.
The U.S. Food and Drug Administration (FDA) is a regulatory agency that ensures the safety and effectiveness of products such as foods, medicines, and cosmetics.
Federal Standard 209E (FED-STD-209E) establishes air quality standards for clean rooms. A numeric classification system describes the number of airborne particles larger than 0.5 microns. For example, Class 100 environments contain no more than 100 particles larger than 0.5 microns per cubic foot of air. Similarly, Class 1000 environments contain no more than 1000 particles larger than 0.5 microns per cubic foot of air.
Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl and polybrominated diphenyl ether. RoHS will become effective on July 1, 2006.
Devices do not contain lead (Pb) in any form. The electronics industry is working to provide lead-free products in response to concerns about the environmental impact of using lead in solder finishes. These efforts are in response to both customer demands and government directives to decrease the amount of waste from consumer electronics. Officially a product defined as a lead-free has less than 1000 ppm lead by weight.
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Companies are located in the Northeast United States, namely Connecticut, Maine, Massachusetts, New Hampshire, New Jersey, New York, Pennsylvania, Rhode Island and Vermont.
Companies are located in the Southern United States, namely Alabama, Arkansas, Delaware, Florida, Georgia, Kentucky, Louisiana, Maryland, Mississippi, Missouri, North Carolina, Oklahoma, South Carolina, Tennessee, Texas, Virginia, Washington D.C., and West Virginia.
Companies are located in the Midwest United States, namely Illinois, Indiana, Iowa, Kansas, Michigan, Minnesota, Nebraska, North Dakota, Ohio, South Dakota and Wisconsin.
Companies have facilities in South American countries such as Argentina, Brazil, or Chile; or in Central American countries such as Costa Rica, Honduras, Panama, etc.
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