Supplier can assist with concepts, manufacturing costs, manufacturing techniques and material considerations. Supplier may also be able to assist in upgrading or redesigning, re-evaluating or modernizing existing products to increase performance and/or reduce manufacturing costs. Suppliers often employ CAD, structural and thermal analysis software to improve the design process.
Development of new or specialized MEMS devices and manufacturing processes on a contract basis to meet the requirements for specific applications. Also, research into underlying factors or properties required for consistently controlling material critical components and maintaining product performance.
Other proprietary, specialized or unlisted capabilities.
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In 2D surface micromachining processes layers of material are build up with deposition processes and selectively etched of electrochemically machinined. These processes are essentially the same techniques as those used in IC fabrication from silicon wafers where the bulk of the substrate remains untouched.
In 3D, or bulk micromachining, large portions of the substrate are removed to form the desired structure. LIGA processes would fall into this category. Structures with greater heights can be formed because thicker substrates can be used. The bulk micromachining process is a key fabrication method used for MEMS-based photonic switching in the high-growth optical and wireless markets.
Inspection encompasses physical and chemical examination of MEMS or microelectronics structures using SEM or optical microscopy, ellipsometry, spectroscopy or other analytical technique. Testing is actual wafer probing or device electrical testing (functional back end testing or parametric in process tests).
Electrical functional testing is a process used to sort and/or mark die on wafers based on electrical performance. Wafer sorters or probes preform functional tests on dies in wafers or on packaged MEMS or IC devices. Functional tests verify the operation of all device functions and then defective dies or chips are marked. Ink marks were traditionally used, but electronic wafer maps are now being employed.
Probing instruments are used for in-line parametric or wafer sorting electrical tests on gates, MEMS devices, IC devices or electrical circuits. In-line parametric tests are preformed on scribe line or process control monitors (SLM / PCM) to assure wafer level reliability.
The LIGA processes combine photolithography, electroplating and molding to obtain depth. Patterns are created in a substrate and then electroplated to create 3D molds. These molds can be used as the final product, or various materials can be cast or injected into them. LIGA falls under the High Aspect Ratio Micromachining (HARM) category because devices with very high aspect ratios can be built. Another advantage of LIGA processes is the ability to fabricate materials other than silicon can be used (e.g., metal, plastic).
Oxidation and diffusion processes are furnacing operations. Oxidation produces dielectric oxide layers on silicon substrates. Doping introduces impurities, such as P or B in silicon semiconductors, to alter the intrinsic conductivity of the semiconductor and produce n or p type semiconductor regions. Diffusion drives the dopants into the semiconductor.
Back end or packaging processes include dicing, backgrinding, wire bonding, die bonding, assembly and hermetic sealing. Packaging is the assembly of a device into a container or package with interconnect features that allows integration into a larger system or product.
Lithography processes transfers circuit or device patterns onto a substrate using a patterned mask and a beam of light or electrons to selectively expose a photoresist layer. Uncured photoresist is removed and the wafers are exposed to an acid or chemical solution that selectively etches the uncovered regions of the substrate.
The circuit patterns are usually formed using a screen-printing process using a paste of metal or other materials that is subsequently fired onto the surface.
Wafer bonding processes includes anodic bonding, fusion bonding, metal bonding or polymeric bonding. Wafer bonding is used to join stacks of wafer to form reference cavities or other structures in MEMS devices.
Other unlisted, specialized or proprietary processes.
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Silicon is a metalloid element with intrinsic semiconducting properties. Silicon is a semi-insulator in its undoped pure form. Silicon is one of the most common materials used to fabricate IC and MEMS devices.
Industrial ceramic materials consist of oxides, carbides, nitrides, carbon and other non-metals with high melting points. Ceramics are suitable for applications requiring wear resistance, refractoriness, low electrical resistivity or other specialized characteristics.
Glass is a homogeneous material with a random, liquid like (non-crystalline) molecular structure. The manufacturing process requires that the raw materials be heated to a temperature sufficient to produce a completely fused melt. Silicate based glasses are the most common.
Devices fabricated using nickel or other metals. Metals provide more mechanical strength compared to typical semiconductor materials such as silicon or germanium.
Other proprietary, specialized or unlisted materials.
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In 1987, International Standards Organization (ISO) 9000 standards were developed to ensure that companies' products and services have consistent, documented approaches that meet the European community's quality requirements.
ISO 9001 sets out the requirements for an organization whose business processes range all the way from design and development, to production, installation and servicing.
ISO 9002 is a quality assurance model made up of quality system requirements. This model applies to organizations that produce, install, and service products. ISO expects organizations to apply this model, and to meet these requirements, by developing a quality system.
QS is an enhanced version of ISO that reflects the needs of the automotive industry. This certification is required for all first-tier suppliers of the Big Three automakers.
QS9000 defines the fundamental quality system expectations of manufacturers for internal and external suppliers of production and service parts and materials. These companies are committed to working with suppliers to ensure customer satisfaction beginning with conformance to quality requirements
Processes and facilities certified or approved to AS 9100 standards. AS9000 is a aerospace sector-specific ISO standard ISO. Compliance to the unique elements of AS9000 is typically assessed in conjunction with a full certification audit to ISO 9001 or ISO 9002. AS9000 contains approximately 36 clarifications of the ISO 9000 Standard, to more clearly identify expectations for the various aerospace suppliers serving aerospace companies.
Other unlisted, specialized, or proprietary certification or standard.
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Companies are located in the Northeast United States, namely Connecticut, Maine, Massachusetts, New Hampshire, New Jersey, New York, Pennsylvania, Rhode Island and Vermont.
Companies are located in the Southern United States, namely Alabama, Arkansas, Delaware, Florida, Georgia, Kentucky, Louisiana, Maryland, Mississippi, Missouri, North Carolina, Oklahoma, South Carolina, Tennessee, Texas, Virginia, Washington D.C., and West Virginia.
Companies are located in the Midwest United States, namely Illinois, Indiana, Iowa, Kansas, Michigan, Minnesota, Nebraska, North Dakota, Ohio, South Dakota and Wisconsin.
Companies have facilities in South American countries such as Argentina, Brazil, or Chile; or in Central American countries such as Costa Rica, Honduras, Panama, etc.
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